RFM6601-ST

RFM6601-ST
Details:
The RFM6601-ST is a compact LoRaWAN module built on the ASR6601 SoC, engineered for Sub 1GHz wireless communication across 433.92 / 470 / 868 / 915 MHz bands. It combines 22 dBm transmit power with –138 dBm sensitivity, ensuring long range connectivity and robust signal integrity. With 2.4–3.7 V operating voltage, low receive current (10 mA), and a 18 × 16 × 2.8 mm SMT package, the module is optimized for automated EMS/PCBA production and scalable deployment in IoT and industrial applications.
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Description
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Technical Specifications

 

Specification

Value

Chipset

ASR6601 SoC

Frequency Bands

433.92 / 470 / 868 / 915 MHz Sub‑1GHz

Operating Voltage

2.4 – 3.7 V

Modulation

LoRa

Transmit Current

108 mA

Receive Current

10 mA

Sensitivity

–138 dBm

Transmit Power

22 dBm

Dimensions

18 × 16 × 2.8 mm

Interface

SPI

Peripheral Support

Multiple GPIOs, 32.768 KHz crystal oscillator, channel listening, high‑precision RSSI, 12‑bit ADC/DAC

Compliance

FCC / CE / RoHS / REACH certified

 

Application Fields

 

  • Smart metering – utility data collection and remote monitoring.
  • Building automation – alarms, access control, smart lighting, HVAC systems.
  • Remote control systems – reliable long‑range operation.
  • Security systems – intrusion detection and monitoring.
  • Smart parking & smart city – infrastructure connectivity.
  • Environmental monitoring – air quality, water, and soil sensors.
  • Supply chain & logistics tracking – asset visibility and movement monitoring.

 

The module's long‑range communication and low‑power design make it ideal for IoT deployments requiring robust connectivity and extended device lifetime.

 

PCBA Integration Advantages

 

  • SMT Compatibility: Standard 18 × 16 mm package supports automated pick‑and‑place and lead‑free reflow soldering.
  • Peripheral Integration: GPIOs, ADC/DAC, and external oscillator simplify PCB design and expand functionality.
  • Power Efficiency: Optimized for battery‑powered IoT devices with low receive current (10 mA).
  • RF Layout Optimization: Maintain impedance‑matched antenna traces and reserve clean RF zones for stable performance.
  • Mass Production Ready: Fully compatible with SMT/PCBA processes, compliant with FCC, CE, RoHS, and REACH standards.

 

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