8618520826307
info@pcba-china.com
enEnglish
Menu

Quality Control Process

 

STHL operates seven fully automated SMT production lines, supported by advanced equipment, strict quality management, and an intelligent service system. This integrated approach ensures that every stage of production is standardized and delivers consistent, high‑quality results.

 

01 – Process Review

 

Before production begins, we conduct a comprehensive process review to evaluate the specific requirements of each PCBA project. This early assessment aligns design and manufacturing, reducing risks and ensuring optimal quality outcomes.

 

02 – Incoming Quality Control (IQC)

 

  • Material Counting - X Ray component counters for high value or critical parts (ICs, BGAs).
  • Visual Inspection - Package, batch, labeling, and specification consistency.
  • Dimensional & Electrical Sampling - Resistance, capacitance, inductance, transistor parameters, ESD protection.
  • Compliance Verification - RoHS/REACH conformity and supplier certifications.
  • Batch Traceability - Barcode scanning linked to MES; strict moisture/ESD safe storage; FIFO inventory management.
iqc

 

03 – Solder Paste Inspection (SPI)

 

  • Precision Control - Thickness, area, offset, bridging; XY accuracy within ±20 μm.
  • Defect Prevention - Early detection of insufficient, excessive, or missing solder deposits.
  • Data Integration - Results automatically uploaded to MES.
  • Optional Full Coverage - 3D inspection of every solder pad available upon request.

 

04 – SMT Placement

 

  • First Article Verification - Placement accuracy, polarity, and process parameters.
  • High Speed Precision - Panasonic NPM D3 placement systems with intelligent vision and MES integration.
smt line

 

05 – Automated Flying Probe First Article Test (FAT)

 

  • Component Verification - Type, orientation, polarity, and package recognition.
  • Defect Detection - Real‑time BOM/coordinate comparison to identify missing, incorrect, or excess parts.
  • Visual Highlighting - Pinpoints anomalies for immediate review.
  • Traceable Reporting - Automated reports integrated with BOM and MES systems.

 

06 – AOI + Manual Sampling

 

  • Coverage - Pre and post reflow inspection of placement, polarity, offset, and solder defects.
  • Resolution - Detection down to 01005 components.
  • Cross Validation - Manual sampling cross checks AOI results; all data uploaded to MES.
AOI

 

07 – Visual Inspection + X Ray

 

  • Visual Checks - Solder joint quality, bridging, and missing solder.
  • X‑Ray Analysis - 100% inspection of BGAs/QFNs for voids, bridging, or hidden defects.
  • Reliability Verification - Confirms solder integrity and interconnect reliability.
  • Traceability - High‑resolution images and inspection data archived in MES.

 

08 – In Circuit Test (ICT)

 

  • Mass Production Testing - Bed of nails fixtures measure electrical parameters and detect opens/shorts.
  • Traceable Results - Automated reports uploaded to MES.
ICT

 

09 – Functional Test (FCT)

 

  • Powered Validation - Verifies functionality, interfaces, and signal integrity under load simulation.
  • Repeatable & Automated - Dedicated fixtures ensure consistency; IPC/ISO compliant.
  • MES Integration - Test data fully traceable.

 

10 – Conformal Coating

 

  • Protection - Moisture, salt spray, dust resistance; enhances insulation and reliability.
  • Automated Application - Selective spraying, masking, UV/IR curing.
  • Standardized Process - IPC/ISO compliant workflows.
  • Inspection & Traceability - UV coverage checks, adhesion testing; results archived in MES.
Conformal Coating

 

11 – Reliability Testing

 

  • Environmental Simulation - Burn‑in, thermal cycling, vibration, and salt spray testing.
  • Traceability - All test data archived for long‑term reference.

 

12 – Outgoing Quality Control (OQC)

 

  • Visual Inspection - Silkscreen, labels, orientation, solder joints.
  • Functional Testing - Full or sample based testing per customer requirements.
  • Microscopic Analysis - 3D microscopy for critical solder joints and connectors.
  • Traceable Documentation - Certificates of Conformance (COC), First Article Inspection (FAI), test records.
  • Packaging Verification - Quantity, labeling, barcodes, packaging integrity.
OQC-3D microscopy

 

 

Triple Layer Quality Assurance

 

  • IPQC – In‑Process Quality Control: On‑site monitoring, IPC‑A‑610 compliance, MES feedback, 8D/PDCA corrective actions.
  • MES – Manufacturing Execution System: Barcode scanning, laser marking, PLC/sensor data, real‑time alarms, 10‑year traceability.
  • QA – Quality Assurance System: IPC/ISO/IATF frameworks, process audits, SOP control, operator training, corrective actions.

 

Quality Control & Test Reports

 

STHL provides a full set of quality control and test reports aligned with IPC, ISO, IATF, and JEDEC standards:

  • Incoming & Standard Inspection - IQC, RoHS/REACH compliance, HIC.
  • Dimensional & Structural Analysis - Full dimensional, CMM, microsection.
  • Process & Manufacturing Tests - AOI, X Ray, solderability, impedance.
  • Electrical & Functional Testing - ICT, FCT, programming verification.
  • Final & Outgoing Inspection - IPC A 610 final inspection, OQC, NCR.
  • Environmental & Reliability Testing - Thermal cycling, salt spray, drop/vibration.
FCT

 

Quality Certifications

 

Our manufacturing partners operate in full compliance with internationally recognized standards:

  • ISO 13485:2016 - Medical electronics quality management
  • IATF 16949:2016 - Automotive electronics quality management
  • ISO 9001:2015 - General quality management system
  • ISO 14001:2015 - Environmental management system
  • RoHS & REACH - EU environmental and chemical safety compliance
  • UL, FCC, IC certified materials - Safety and regulatory approval for global markets

 

Quality Issue Resolution & After Sales Assurance

 

  • 8D Corrective Action Process - Problem definition, containment, root cause analysis, corrective and preventive measures.
  • Rework & Refund Policy - Complaints accepted within 5 working days; resolution typically within 1–3 days.
  • STHL Commitment - Free repair or rework and return shipping for manufacturing‑related defects.
  • Scope - Applies only to manufacturing defects confirmed by inspection; excludes design errors or customer‑supplied material issues.
  • Common Issues Covered - Machining/assembly defects, tolerance failures, incorrect material/finish, non‑processable parts, shortages, other confirmed production causes.