HM‑MT2401B-ST

HM‑MT2401B-ST
Details:
The HM MT2401B-ST is a Matter over Thread wireless communication module designed for 2.4 GHz IoT connectivity. Powered by the EFR32MG24 RF SoC with an embedded ARM Cortex M33 core, it integrates 1536 KB Flash and 256 KB RAM, ensuring reliable performance for smart home and industrial IoT applications. With 10 dBm transmit power, –105.7 dBm sensitivity, and ultra low standby consumption of 1.3 µA, the module balances energy efficiency with stable connectivity. Its 22 × 15.8 × 2.6 mm SMT package and UART/SPI interfaces make it fully compatible with automated EMS/PCBA production lines, supporting scalable, high volume manufacturing.
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Description
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Technical Specifications

 

Specification

Value

Protocol Type

Matter over Thread

Frequency Range

2402 – 2483.5 MHz (2.4 GHz band)

Operating Voltage

1.71 – 3.8 V

Operating Temp.

–40 °C to +125 °C

Sensitivity

–105.7 dBm

Transmit Power

10 dBm

Lowest Power Consumption

1.3 µA

Flash Memory

1536 KB

RAM

256 KB

Dimensions

22 × 15.8 × 2.6 mm

Interfaces

UART / SPI

Antenna Options

PCB onboard antenna / external antenna connector

Compliance

RoHS / REACH certified

 

Application Fields

 

  • Smart lighting – lamps, switches, dimmers.
  • Smart plugs and sockets – energy monitoring and remote control.
  • Smart locks and access systems – secure connectivity.
  • Curtain motors and window automation – seamless integration into smart homes.
  • Doorbells and sensors – wireless monitoring and alerts.
  • Thermostats and HVAC control – efficient energy management.
  • General IoT devices – Matter‑compliant upgrades for existing products.

 

The module supports Matter ecosystems and enables direct integration into platforms such as Google Home, Apple HomeKit, Amazon Alexa, and Samsung SmartThings, ensuring interoperability and buyer confidence.

 

PCBA Integration Advantages

 

  • SMT Compatibility: Compact 22 × 15.8 mm package supports automated pick‑and‑place and lead‑free reflow soldering.
  • Peripheral Integration: GPIOs, ADC/DAC, and external oscillator simplify PCB design and expand functionality.
  • RF Layout Optimization: Impedance‑matched antenna traces and reserved RF zones ensure stable wireless performance.
  • Power Efficiency: Ultra‑low standby current (1.3 µA) supports battery‑powered IoT devices.
  • Mass Production Ready: Fully compatible with SMT/PCBA processes, compliant with RoHS and REACH standards.

 

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