Shenzhen STHL Technology Co., Ltd. is one of the leading manufacturers and suppliers of rfm69hc-st in China. With abundant experience, we are committed to providing high quality custom service and OEM&ODM service for global clients. Please feel free to buy cost-efficient rfm69hc-st from our factory.
Technical Specifications
|
Specification |
Value |
|
Type |
RF transceiver module |
|
Function |
TRx (transmit & receive) |
|
Modulation |
2(G)FSK / MSK / OOK |
|
Data rate |
Up to 300 Kbps |
|
Frequency |
315 / 433 / 868 / 915 MHz |
|
Receiver sensitivity |
–120 dBm |
|
Transmit power |
+20 dBm |
|
Dimensions |
16 × 16 × 1.9 mm |
|
Interface |
SPI |
|
Compliance |
RoHS / REACH |
Application Fields
- Automatic meter reading (AMR): Utility metering and remote data collection.
- Wireless sensor networks: Environmental monitoring, asset tracking.
- Residential and building automation: Access control, HVAC, lighting.
- Security and alarms: Intrusion alarms, perimeter sensors.
- Industrial monitoring and control: Machine telemetry, remote control links.
- Wireless M‑BUS: Sub‑1GHz metering communication stacks.
Why It Fits
- Long‑range readiness: +20 dBm output supports extended coverage and penetration.
- High sensitivity: Stable reception for low‑SNR links and dense RF environments.
- Flexible modulation: Interoperability across legacy and modern systems.
- Compact SMT footprint: Minimal PCB area for tight enclosures.
PCB/PCBA Integration Guidance
1. SMT readiness: SPI interface and SMT package support automated pick‑and‑place and standard reflow profiles.
2. Antenna and RF path:
- Placement: Reserve a clean RF zone; keep antenna/feed away from high‑noise digital domains and switching supplies.
- Impedance control: Maintain matched impedance from antenna to RF pins; minimize stubs and sharp bends.
- Ground strategy: Use a stitched ground plane; keep out ground under the antenna region.
3. Power integrity:
- Decoupling: Place low‑ESR bypass capacitors close to VCC/GND pins.
- TX bursts: Ensure the 315–915 MHz rail remains stable under +20 dBm transmit bursts.
4. Testability & DFM:
- Access points: Provide pads for SPI, TRx data, and power rails to streamline ICT/AOI.
- Silks & fiducials: Clear reference marks improve placement accuracy and yield.
5. BOM simplification:
- External parts: Only essential passives for matching/decoupling; reduces assembly complexity and cost.
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