RFM69-ST

RFM69-ST
Details:
The RFM69-ST is a Sub 1GHz RF transceiver module operating on 433, 868, and 915 MHz ISM bands. It supports 2(G)FSK, MSK, and OOK modulation with data rates up to 300 Kbps, combines –120 dBm receiver sensitivity with +13 dBm transmit power, and comes in a compact 16 × 16 × 1.9 mm SMT form factor. The SPI interface and low power profile make it suitable for battery powered devices and high volume SMT/PCBA lines.
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Description
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Technical Specifications

 

Specification

Value

Type

RF transceiver module

Function

TRx (transmit & receive)

Modulation

2(G)FSK / MSK / OOK

Data rate

Up to 300 Kbps

Frequency

433 / 868 / 915 MHz

Receiver sensitivity

–120 dBm

Transmit power

+13 dBm

Dimensions

16 × 16 × 1.9 mm

Interface

SPI

Compliance

RoHS / REACH

 

Application Fields

 

  • Automatic meter reading (AMR): Utility metering and remote data collection.
  • Wireless sensor networks: Environmental sensing, asset monitoring.
  • Residential and building automation: Access control, HVAC, lighting.
  • Security and alarms: Intrusion alarms, perimeter sensors.
  • Industrial monitoring and control: Machine telemetry, remote control links.
  • Wireless M‑BUS: Sub‑1GHz metering communication stacks.

 

Why It Fits

 

  • High sensitivity: Stable reception for low‑SNR links.
  • Flexible modulation: Interoperability across legacy and modern systems.
  • Compact SMT: Minimal PCB footprint for tight enclosures.

 

PCB/PCBA Integration Guidance

 

1. SMT readiness: SPI interface and SMT package support automated pick‑and‑place and standard reflow profiles.

2. Antenna and RF path:

  • Placement: Reserve a clean RF zone; keep antenna/feed away from high‑noise digital and switching supplies.
  • Impedance control: Maintain matched impedance from antenna to RF pins; minimize stubs and sharp bends.
  • Ground strategy: Use a stitched ground plane; keep out ground under the antenna region.

3. Power integrity:

  • Decoupling: Place low‑ESR bypass capacitors close to VCC/GND pins.
  • Rail stability: Ensure supply regulation suitable for TX bursts at +13 dBm.

4. Testability & DFM:

  • Access points: Provide pads for SPI, TRx data, and power rails to streamline ICT/AOI.
  • Silks & fiducials: Clear reference marks improve placement accuracy.

5. BOM simplification:

  • External parts: Only essential passives for matching/decoupling; reduces assembly complexity and cost.

 

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