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X-Ray Inspection

X-Ray Inspection
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On Shenzhen STHL Technology Co., Ltd.'s production lines, there is an inspection process that acts like an "X-ray eye" for circuit boards — X-Ray Inspection. When the solder joints of components such as BGAs and QFNs are completely hidden beneath the package, even the sharpest lenses in traditional AOI (Automated Optical Inspection) cannot detect them. X-Ray Inspection penetrates materials to clearly reveal the internal structure. It not only uncovers defects invisible to the naked eye, but also records every inspection result in digital form, providing a solid, traceable basis for quality control.
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Description
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Why X-Ray Inspection Is Indispensable in Modern Manufacturing

 

In high-density, high-reliability PCBA manufacturing, X-Ray Inspection is not just a "nice-to-have" - it is a critical step in ensuring product stability:

  • Non-destructive testing: Obtain internal structural images without disassembling or damaging the PCB.
  • High-resolution imaging: Clearly visualize the bottom solder joints of BGAs, QFNs, and other components, identifying issues such as cold solder joints, voids, and bridging.
  • Data-driven analysis: Combined with PCB x-ray analysis technology, automatically detects defects and generates inspection reports for quality traceability.
  • Full-process adaptability: From incoming material checks to final product sampling, PCB X-Ray Inspection plays a vital role.
x-ray

 

Typical Applications of X-Ray Inspection

 

  • BGA package inspection: Verify solder ball position, shape, and solder volume against process standards.
  • Multilayer board inner-layer inspection: Detect hidden defects such as broken traces or shorts within inner layers.
  • Post-reflow quality verification: Quickly assess the stability of the soldering process.
  • Failure analysis: Pinpoint root causes during repair or failure analysis using X-ray imaging.
  • THT fill rate measurement: Evaluate solder fill in through-hole joints.
  • HIP inspection (Head-in-Pillow): Identify defects where solder balls have not fully fused with the pad.
xray and bga

 

Inspection Methods and Technical Highlights

 

  • Manual X-ray Inspection (MXI): Ideal for R&D, small batches, or special sample testing. Highly flexible, and can be paired with 3D reconstruction (CT scanning) to produce layered or cross-sectional images for precise dimensional measurement.
  • Inline Automated X-ray Inspection (3D AXI): Designed for high-speed production lines, capable of inspecting a single board in seconds. Supports 2D, 2.5D, and 3D inspection modes. High-end systems can process multiple PCBs simultaneously, greatly improving throughput.

 

Core Technical Advantages

 

  • Microfocus transmission tube for exceptional image clarity and stability.
  • Digital flat-panel detector for high magnification and high-definition imaging.
  • 360° rotation and tilt modules for multi-angle observation of complex structures.
  • Integrated CT functionality for 3D reconstruction and precise measurement.
xyray machine

 

Deployment in the Production Process

Incoming material stage

Perform PCB x-ray analysis on critical components to ensure no internal cracks or hidden solder defects.

In production

Conduct PCB X-Ray Inspection after BGA reflow to promptly detect soldering issues.

Pre-shipment

Randomly inspect finished products to ensure zero-defect delivery.

 

FAQs

 

Q1: Will X-Ray Inspection damage components?

A1: No. The process is non-destructive, and radiation levels are far below safety limits.

Q2: What advantages does X-Ray Inspection have over AOI?

A2: AOI focuses on external appearance, while X-rays can reveal internal structures - making them ideal for inspecting hidden solder joints.

Q3: Does inspection speed affect production efficiency?

A3: Modern high-speed X-ray systems can match production line cycle times without creating bottlenecks.

Q4: Is it suitable for small-batch production?

A4: Yes - especially for high-value or high-reliability products, which can undergo full or sample inspections before shipment.

 

Conclusion

 

At STHL, we integrate X-Ray Inspection with AOI, ICT, FCT, and other inspection methods to create a comprehensive quality control system covering appearance, structure, and function. Whether for high-density consumer electronics or high-reliability industrial and medical devices, we deliver high-precision, fully traceable X-ray inspection solutions that leave no hidden defect undetected.

 

For more details about our X-Ray Inspection services, please contact info@pcba-china.com.

 

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