Copper Foil Substrate (Copper Film)
Copper foil is generally divided into electrolytic copper and rolled copper. Common thicknesses are 1oz, 1/2oz, and 1/3oz.
Substrate Film: Common thicknesses are 1mil and 1/2mil.
Glue (Adhesive): Thickness depends on customer requirements.
Cover Film
Cover Film: Used for surface insulation. Common thicknesses are 1mil and 1/2mil.
Glue (Adhesive): Thickness depends on customer requirements.
Release Liner: Prevents foreign matter from sticking to the adhesive before lamination and facilitates assembly.
PI Stiffener Film
Stiffener: Enhances the mechanical strength of the FPC and facilitates surface mounting. Common thicknesses range from 3mil to 9mil.
Glue (Adhesive): Thickness depends on customer requirements.
Release Liner: Prevents foreign matter from sticking to the adhesive before lamination.
EMI: Electromagnetic interference shielding film protects the circuitry within the circuit board from external interference (strong electromagnetic fields or areas susceptible to interference).
