Flexible Printed Circuit (FPC), also known as flexible printed circuit (FPC), is highly sought after for its lightweight, thin, and flexible foldability. However, domestic FPC quality inspection still relies primarily on manual visual inspection, which is costly and inefficient. With the rapid development of the electronics industry, circuit board designs are increasingly moving towards higher precision and higher density. Traditional manual inspection methods are no longer sufficient to meet production demands, and automated FPC defect detection has become an inevitable trend in the industry.
Flexible printed circuit (FPC) originated in the 1970s in the United States to develop space rocket technology. Made from a polyester film or polyimide substrate, it is a highly reliable and extremely flexible printed circuit. By embedding circuitry onto a thin, flexible plastic sheet, it allows for the integration of numerous precision components into narrow and confined spaces, creating a flexible circuit. This flexible circuit can be bent and folded freely, is lightweight, compact, has excellent heat dissipation, and is easy to install, revolutionizing traditional interconnect technology. In the structure of flexible circuits, the constituent materials are insulating films, conductors and adhesives.
