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DIP Assembly

DIP Assembly
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On Shenzhen STHL Technology Co., Ltd.'s production lines, DIP Assembly remains a core process for many high-reliability electronic products. After SMT placement is completed, certain high-power devices, connectors subject to significant mechanical stress, or components requiring long-term stable operation still need to be soldered and secured via the Through-Hole Assembly process.

Depending on the product's characteristics, we select from automated DIP insertion, wave soldering, DIP Soldering, or manual soldering to ensure every solder joint meets IPC A 610 high reliability standards.

Leveraging over 20 years of PCBA manufacturing experience, full-process MES control, and the flexible integration of multiple SMT and THT production lines, STHL can efficiently switch between smt and thru hole technology in hybrid production, meeting diverse requirements from small-batch customization to large-scale mass production.
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Description
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What is DIP Assembly?

 

A DIP (Dual In-line Package) is a package type with a row of parallel pins on each side. Component leads pass through pre-drilled holes in the PCB and are soldered in place on the opposite side. In PCBA manufacturing, DIP Assembly is often a post-soldering step following SMT, ensuring both electrical connectivity and mechanical strength.

  • Typical Features: Rectangular package, two rows of parallel pins, typically no more than 100 pins.
  • Common Devices: DIP integrated circuits, power devices (TO series), diodes (DO series), etc.
  • Process Location: Used in conjunction with through hole and surface mount technology in hybrid processes.
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DIP Assembly Process Flow

 

1. Incoming Material and Appearance Inspection

  • Verify component model, quantity, package size, silkscreen number, and parameter values.
  • Check component surfaces for cleanliness to avoid oil, coatings, or other contaminants that could affect soldering.

2. Component Molding and DIP Insertion

  • Pre-form certain components according to PCB design and soldering requirements.
  • Control insertion force to avoid damaging the PCB or components.
  • Ensure consistent orientation, position, and height, with full contact between pins and pads.

3. Soldering Methods

  • Wave Soldering: Highly efficient, automated batch soldering.
  • Selective Wave Soldering: Suitable for localized soldering on mixed-assembly boards.
  • DIP Soldering: A standardized batch soldering process for dual-in-line package devices, ensuring high solder joint consistency.
  • Manual Soldering: Ideal for small batches, special structures, or heat-sensitive components.

4. Cleaning and Inspection

  • Remove residual flux, ionic contaminants, and organic impurities after soldering.
  • Perform AOI (Automated Optical Inspection), ICT (In-Circuit Testing), and FCT (Functional Testing) to verify electrical performance and reliability.
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Key Quality Control Points

 

  • Maintain a high insertion yield to ensure components fit tightly to the PCB.
  • Strictly follow component orientation markings to avoid reverse insertion.
  • Control component height and spacing to prevent protrusion beyond the PCB edge.
  • Apply appropriate insertion force to prevent PCB deformation or pad lifting.

 

Automated vs. Manual DIP Assembly

 

Automated DIP Assembly

  • Suitable for high-volume, high-complexity production with multiple DIP components.
  • Equipment enables rapid positioning and soldering, delivering high efficiency and lower costs.
  • Capable of handling PCBs of varying sizes and complexities.

Manual DIP Assembly

  • Suitable for small batches, special structures, or delicate components.
  • Highly flexible, allowing real-time adjustments to insertion and soldering methods.
  • Facilitates customization and specialized process handling.
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Application Scenarios

 

  • Industrial control boards and power control modules.
  • Automotive electronics and energy equipment control boards.
  • Medical equipment and other high-reliability electronic products.
  • Audio equipment and experimental boards for education and R&D.

 

Summary and Invitation for Collaboration

 

In the through-hole assembly field, DIP Assembly remains the preferred process for many high-reliability products due to its high mechanical strength, excellent heat dissipation, and ease of maintenance. If your project requires efficiency, stability, and high consistency in Through-Hole Assembly, STHL's DIP Assembly solutions can provide comprehensive support - from process evaluation and fixture design to mass production.

 

Send your Gerber files and requirements to: info@pcba-china.com - Let us deliver a high-standard DIP Assembly that strengthens your product's performance and delivery schedule.

 

 

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