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Metal substrates are widely used in electronic devices due to their excellent thermal conductivity and thermal stability.

Metal substrates are primarily used to address thermal conductivity and load-bearing issues.

Metal substrates help address heat dissipation challenges in high-density, high-power circuit boards.

High-frequency PCBs are primarily made of materials with high dielectric constants and low high-frequency losses.

The manufacturing process for high-frequency PCBs is unique, requiring a variety of processes including electromagnetic induction heating, rolling, an

Overcurrent protection on the main control board is often inadequate, requiring immediate protection from the driver circuit or driver.

Rigid-flex designs typically transition from rigid to flexible and back to rigid again.

Suitable for scenarios requiring wiring within complex three-dimensional spaces, such as wearable devices and foldable electronic devices.

During operation, a rigid-flexible panel can adjust its stiffness and flexibility based on the required external forces and stresses.

A rigid-flex board consists of several layers of materials stacked according to a specific pattern, including both rigid and flexible materials.

Flexible circuits can be bent and folded freely, flexing tens of thousands of times without damage.

Used for surface insulation. Common thicknesses are 1mil and 1/2mil.