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Used for surface insulation. Common thicknesses are 1mil and 1/2mil.

Pre-production processing involves three key aspects, all of which are performed by engineers.

In the electronics sector, flexible circuit boards, with their lightweight, flexible nature, open up new possibilities for product design and manufact

The most commonly used flexible substrate, low cost but with poor weather resistance.

Tensile strength ≥ 300 MPa (when used in critical structures);

Their flat surface also facilitates operation on automated production lines.

Rigid plates are plates that deform very little when subjected to force, while elastic plates deform significantly when subjected to force.

Rigid circuit boards must adhere to certain standards and specifications during their production process.

The copper foil substrate is first cut into sizes suitable for processing and production.